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E-mail : sales@antekelectronics.com
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Production

 

PCB Manufacture Capabilities
No Items Capabilities(for Sample) Capabilities(for Mass Production)
1 Layer count 1-26L 1-16L
2 Board Thickness 0.2-7.0mm 0.4-6.0mm
3 Maximum Board Size 610*1100mm 550*650mm
4 Copper Thickness Inner Layer: H-4OZ Inner Layer: H-4OZ
Outer Layer: H-5OZ Outer Layer: H-5OZ
5 Minimum Finished Hole Size 0.1mm 0.15mm
6 Hole Diameter Tolerance PTH: ±0.05mm PTH: ±0.075mm
NPTH: ±0.05mm NTTH: ±0.05mm
7 Maximum Aspect Ratio 8:1 8:1
8 Minimum Line Width 3.0mil 4.0mil
9 Minimum Line Spacing 3.0mil 4.0mil
10 Outline Size Tolerance ±0.10mm ±0.15mm
11 Minimum Bow and Twist 0.50% 0.75%
12 Soldermask Color Green,Yellow,Black,Blue,Red,White,Purple Green,Yellow,Black,Blue,Red,White,Purple
13 Minimum Solder Mask Dam 4mil(Green),5mil(Other color) 4mil(Green),5mil(Other color)
14 Silkscreen Color White,Yellow,Black White,Yellow,Black
15 HASL Tin Thickness 2-40um 2-40um
16 Flash Gold(electroplated gold) Ni:≥3um;Au:0.025-0.1um Ni:≥3um;Au:0.025-0.1um
17 ENIG Ni:3-8um;Au:0.05-0.1um Ni:3-8um;Au:0.05-0.1um
18 Immersion Tin ≥1.0um ≥1.0um
19 Immersion Silver 0.2-0.4um 0.2-0.4um
20 OSP 0.1-0.3um 0.1-0.3um
21 Hard Gold 0.1-4.0um 0.1-4.0um
22 ENEPIG Ni:3-8um;Pd:0.05-0.15um;Au:0.05-0.1um Ni:3-8um;Pd:0.05-0.15um;Au:0.05-0.1um
23 Carbon 0.10-0.35um 0.10-0.35um
24 Peelable Solder mask 0.20-0.50mm 0.20-0.50mm
25 Raw Material FR-4,High Tg FR-4,Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates FR-4,High Tg FR-4,Halogen-Free,PTFE,Aluminum base material,Ceramic Partide Filled Laminates
26 Surface Treatment Sn/Pb HASL,Leadfree HASL,Flash Gold,ENIG,Immersion Tin,Immersion Silver,OSP(Entek),Hard Gold,Soft Gold,ENIG+OSP,ENIG+Gold finger,Hard Gold+Gold finger,Immersion Silver+Gold finger,Immersion Tin+Gold finger,ENEPIG Sn/Pb HASL,Leadfree HASL,Flash Gold,ENIG,Immersion Tin,Immersion Silver,OSP(Entek),Hard Gold,Soft Gold,ENIG+OSP,ENIG+Gold finger,Hard Gold+Gold finger,Immersion Silver+Gold finger,Immersion Tin+Gold finger,ENEPIG